Samples that need to be addressed electronically have to be wire bonded. As an opportunity to contact such samples, the Nanolab offers a thermosonic wire or ribbon wedge bonder making use of an ultrasonic bonding method.
The HB06, manufactured by TPT Wire Bonder GmbH & Co KG, is capable of making 13 µm to 76 µm (= 0.5 mil to 3.0 mil) gold or aluminum wire or up to 25 µm × 254 µm (= 1.0 mil × 10.0 mil) gold or aluminum ribbon interconnections.
The bonder can be operated in a manual or a semi-auto bonding mode which differ in their manual or automated vertical control, respectively. The horizontal displacement is always controlled by hand.
Bonding parameters such as force, ultrasonic energy and time can be set manually and are electronically controlled.
Reference: tpt Technical Product Trade, HB06/08/10 Wire Bonder Operation Manual Version 3.02, 2008.